The SOP-8 has been modified through a customized leadframe for enhanced thermacharacierstics and multip e-dle capabllity making it deal in a varety o powerapplications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phaseinfra red, or wave soldering technigues. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
