The SOP-8 has been modified through a customized eadframe "or enhanced therma characterstics and multiple-die capability making it ideal in a variety of power applications. With these improvements. multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase. infra red. or wave solderino techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
