The so-8 has been modified through a customized leadtrame for enhanced thermal characteristics and multiple die capability making it ideal in a varietyof power applications. Withtheseimprovements. multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase. infra red. or wave soldering technigues. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
