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TB8S
  • Glass Passivated Chip Juntion

  • Reverse Voltage - 50 to 1000 V

  • Forward Current - 0.8 A

  • High Surge Current Capability

  • Designed for Surface Mount Application

W10
  • The plastic material used carries Underwriters Laboratory flammability recognition 94V-0  

  • Ideal for printed circuit board mounting  

  • High surge current capability

  • High temperature soldering guaranteed 265 C /10 seconds at 5 lbs (2.3kg) tension

W08
  • The plastic material used carries Underwriters Laboratory flammability recognition 94V-0  

  • Ideal for printed circuit board mounting  

  • High surge current capability

  • High temperature soldering guaranteed 265 C /10 seconds at 5 lbs (2.3kg) tension

W06
  • The plastic material used carries Underwriters Laboratory flammability recognition 94V-0  

  • Ideal for printed circuit board mounting  

  • High surge current capability

  • High temperature soldering guaranteed 265 C /10 seconds at 5 lbs (2.3kg) tension

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