For surface mounted applications
Low profile package
Glass Passivated Chip Junction
Ideal for automated placement
Lead free in comply with EU RoHS 2011/65/EU directives
Metal silicon junction, majority carrier conduction
For surface mounted applications
Low power loss, high efficiency
High forward surge current capability
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
Metal silicon junction, majority carrier conduction
For surface mounted applications
Low power loss, high efficiency
High forward surge current capability
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
