The SOP-8 has been modified throuah a customized leadframe  for enhanced thermal characteristics and multiple-die capability  making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with  dramatically reduced board space.The package is designed for  vapor phase. infra red. or wave so derina techniaues.Power dissipation of qreater than 0.8W is possible in a typical PCB mount  application.

The SOP-8 has been modfied through a customized eadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements. multiple devices can be used in an application with dramatically reduced board space. The package is desianed for vapor phase, inra red, orwave soldering technigues.

The SOP-8 has been modified through a customized  leadframe for enhanced thermal characteristics and  multiple-die capability making it ideal in a variety  of power applications. With these improvements,  multiple devices can be used in an application  with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave  soldering techniques. Power dissipation of greater  than 0.8W is possible in a typical PCB mount application.

The SOP-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements. multiple devices can be used in an application with dramatically reducea board space. The package is designed for vapor phase, infra red, or wave soldering technigues.