The SOP-8 has been modified through a customized eadframe "or enhanced therma characterstics and multiple-die capability making it ideal in a variety of power applications. With these improvements. multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase. infra red. or wave solderino techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.

The SOP-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared, or wave soldering techniques.

The so-8 has been modified through a customized leadtrame for enhanced thermal characteristics and multiple die capability making it ideal in a varietyof power applications. Withtheseimprovements. multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase. infra red. or wave soldering technigues. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.

The SOP-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a  typical PCB mount application.