▪For surface mounted applications
▪Low profile package
▪Glass Passivated Chip Junction
▪Ideal for automated placement
▪Lead free in comply with EU RoHS 2011/65/EU directives
▪For surface mounted applications
▪Low profile package
▪Glass Passivated Chip Junction
▪Ideal for automated placement
▪Lead free in comply with EU RoHS 2011/65/EU directives
▪ For surface mounted applications
▪ Glass Passivated Chip Junction
▪ Fast reverse recovery time
▪ Ideal for automated placement
▪ Lead free in comply with EU RoHS 2011/65/EU directives