The SOP-8 has been modified through a customized eadrame for enhanced thermacharacterstics and multiple die capability making it ideal in a variety of power applications.With these improvements.multiple devices can be used in an application with dramatically reduced board space. The packageis desianed forn vapor phase. infra red, or wave soldering technigues.
The SOP-8 has been modified through a customized eadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of powerapplications. With theseimprovements.multiple devices can be usedinanappication with dramatica v reduced board space. The package is designed for vapor phase, infra red, or wave sodering technigues.
Industry-standard pinout SO-8 Package
Compatible with Existing Surface Mount Techniques
Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
The SOP-8 has been modified through a customized leadframe for enhanced thermacharacierstics and multip e-dle capabllity making it deal in a varety o powerapplications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phaseinfra red, or wave soldering technigues. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
