For surface mounted applications
in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated chip junction
3000W peak pulse power capability
at lOxlOOOUs waveform, repetition
rate {duty cycles):0.01 %
Excellent clamping capability
Low incremental surge resistance
Matte Tin Lead-free Plated

For surface mounted applications in order to
optimize board space.
Low profile package
Glass passivated junction
Low inductance
Plastic package has Underwriters Laboratory
Flammability

For surface mounted applications in order to
optimize board space.
Low profile package
Glass passivated junction
Low inductance
Plastic package has Underwriters Laboratory
Flammability

For surface mounted applications in order to
optimize board space.
Low profile package
Glass passivated junction
Low inductance
Plastic package has Underwriters Laboratory
Flammability