• For surface mounted applications in order to optimize board space.
• Low profile package
• Glass passivated junction
• Low inductance
• Plastic package has Underwriters Laboratory Flammability
• For surface mounted applications in order to optimize board space.
• Low profile package
• Glass passivated junction
• Low inductance
• Plastic package has Underwriters Laboratory Flammability
Low forward voltage
High current capability
High forward surge capability
Low power losses，High efficiency
Guarding for over voltage protection
For surface mounted applications
Low profile package
Glass Passivated Chip Junction
Easy to pick and place
High efficiency·Lead free in comply with EU RoHS 2011/65/EU directives
