The D-PAK is designed for surface mounting using vapor phase,infraredor wave soldering techniques. Power dissipation levels up to 1.5 watts are possible in typical surface mo-unt applications.
The FDD86113LZ is the high cell density trenched N-ch MOSFETS, which provides excellent RDSON and efficiency for most of the small power switching and load switch applications.
The FDD8874 is the high cell density trenched N-ch MOSFETS,which provides excellent RDSON and efficiency for most of the small power switching and load switch applications.
The FQD19N10L is the high cell density trenched N-ch MOSFETS, which provides excellent RDSON and efficiency for most of the small power switching and load switch applications.
