Low profile surface mounted application in order tooptimize board space
High current capability
High surge capability
Glass passivated chipjunction
Lead free parts meet RoHS requirements
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
High forward surge current capability
• For surface mounted applications
• Low profile package
• Glass Passivated Chip Junction
• Superfast reverse recovery time
• Lead free in comply with EU RoHS 2011/65/EU directives
300 Watts peak pulse power (tp =8/20μs)
Bidirectional and unidirectionalconfigurations
Solid-state silicon-avalanche technology
Low clamping voltage
Low leakage current
Low capacitance (Cj=60 pF typ.)
Protection two data lines
IEC 61000-4-2 ±30kV contact ±30kV air
IEC 61000-4-4 (EFT) 40A(5/50ns)
IEC 61000-4-5 (Lightning) 12A(8/20μs)
