For surface mounted applications
Low profile package。Glass Passivated Chip Junction
Easy to pick and place
Lead free in comply with EU RoHS 2011/65/EU directives
This device is an ultra low capacitance PESD product designed to protect very high speed data interfaces. MLSEP05A-0402 has a typical capacitance of only 0.05pf (I/O to GND), and it can be used to meet the ESD immunity requirements of IEC 61000-4-2 (15KV air, 8KV contact discharge).
This device is an ultra low capacitance PESD product designed to protect very high speed data interfaces. MLSEP05A-0402 has a typical capacitance of only 0.05pf (I/O to GND), and it can be used to meet the ESD immunity requirements of IEC 61000-4-2 (15KV air, 8KV contact discharge).
For surface mounted applications in order to optimize board space.
Low profile package
Glass passivated junction
Low inductance
Plastic package has Underwriters Laboratory Flammability