The SOP-8 has been modified through a customized eadframe for enhanced thermal characteristics  and multiple-die capabilitv making it ideal in a  varietyof powerapplications.Withthese improvements.multiple devices can be used in an application with dramatically reduced board space. The  package is desianed fon vapor phase. inra rea. or  wave so gerina technigues Power dissipation of greater than 0.8W is possible in a typical PCB mount application.