The SOP-8 has been modified throuah a customized leadframe  for enhanced thermal characteristics and multiple-die capability  making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with  dramatically reduced board space.The package is designed for  vapor phase. infra red. or wave so derina techniaues.Power dissipation of qreater than 0.8W is possible in a typical PCB mount  application.