The SOP-8 has been modified through a customized  leadframe for enhanced thermal characteristics and  multiple-die capability making it ideal in a variety  of power applications. With these improvements,  multiple devices can be used in an application  with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave  soldering techniques. Power dissipation of greater  than 0.8W is possible in a typical PCB mount application.