The SOP-8 has been modied through a customizec  leadframe for enhanced thermal characteristics and  multiple die capability making it ideal in a variety of  power applications.  With these improvements. multiple devices can be  used in an application with dramatically reduced board  space.  The package is designed for vapor phase. intra red. or  wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.