产品中心
专注于半导体研发、制造和销售业务
IRFR1205TR

The D-PAK is designed for surface mounting using vapor phase,infrared, or wave soldering technigues The straight lead version is for through- hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.

没有找到您要查找的内容?